Difference between revisions of "Photolitho20240619 - MP"
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Result: small features are well observed, even though SU8 surface is with many uneven bubbles. | Result: small features are well observed, even though SU8 surface is with many uneven bubbles. | ||
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+ | Hard bake only 1 hr at 135, since there is no cracks. | ||
Chemical safety precaution: keep all PGMEA-contacted waste inside hood, The hood sash should be raised higher than the thick black line with arrow. | Chemical safety precaution: keep all PGMEA-contacted waste inside hood, The hood sash should be raised higher than the thick black line with arrow. |
Latest revision as of 17:58, 19 June 2024
GM1060, 5um, 4120 rpm-40sec
wafer 1: plasma treatment >8 mins
wafer 2: 135 C 20 mins
(Spin coater setting was changed, there was no program 1- slow speed 400 rpm for 20 sec)
65-5, 95-30
UV-kub-2: 25%, 4 cycles of 4sec
65-5, 95-20
Fresh PGMEA, shake, 1 min
Submerge in IPA, rinse
Result: small features are well observed, even though SU8 surface is with many uneven bubbles.
Hard bake only 1 hr at 135, since there is no cracks.
Chemical safety precaution: keep all PGMEA-contacted waste inside hood, The hood sash should be raised higher than the thick black line with arrow.
Most frequent chance of spill: 1-during washing of PGMEA, left hand (holding the wafer) will be in contact.
2-when pouring the waste to bottles, PGMEA is spilled outside of the bottle.
Maybe need a bigger funnel? Or a glass container with a spout?