Difference between revisions of "20210503 photolitho"

Latest revision as of 15:35, 3 May 2021

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 * cleaned wafers with plasma only
-* 1st wafer
+*  1st wafer Dag's patterns
-** 3100 RPM ~ 25 um
+** 3100 RPM ~ 25 um, 1h rest
+** prebake on VWR hot plate
+**  Masking with UV-Kub 2. UV at 11% intensity for 30 sec.
+** > 10 minutes rest
+** post bake on VWR plate
+** > 10 minutes rest
+** Developed 2:30 min in PGMEA, perfectly developed
+** 2h hard bake at 135C
+* 2nd wafer Anniken and Dag's patterns
+** 3100 RPM ~ 25 um, 1h rest
 ** prebake on programmable hot plate
 **  Masking with UV-Kub 2. UV at 11% intensity for 30 sec.
-** Hot plate too hot, 65C postbake happened at 72-66C
+** >10 minutes rest
-** The hot plate seems to take longer than the timer on my telephone. This needs to be checked!
+** Postbake on programmable hotplate
-** development with PGMEA for 2:45 was too long time! Misjudged the residue and continued another 30s, then it was completely destroyed.
+** 15 minutes rest
-* 2nd wafer Dag's pattern
+** Developed 2:30 min in PGMEA. Overdeveloped!
-** 3100 RPM ~ 25 um
-** prebake on VWR hot plate, no nice control of ramp in temp
-**  Masking with UV-Kub 2. UV at 11% intensity for 30 sec.
-** Postbake on VWR hotplate
-** Developed 3min in PGMEA gave perfect sylinders and gaps between them. quick dip to remove a little residue and done.