Difference between revisions of "20210319 3Dcell labnotes"
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| − | + | == Casting PDMS 10:1 == | |
* poured about 40 ml into disposable beaker on the balance: 32.2g | * poured about 40 ml into disposable beaker on the balance: 32.2g | ||
* poured curing agent by hand until weight was 35.4 g | * poured curing agent by hand until weight was 35.4 g | ||
| Line 8: | Line 8: | ||
* poured carefully over mask and put into oven | * poured carefully over mask and put into oven | ||
| − | + | == Preparing for the next steps == | |
| + | |||
| + | === Making the mufluid circuits === | ||
| + | In room 118 | ||
* 4 medium and 2 big circuits made were not destroyed by breaking the wafer | * 4 medium and 2 big circuits made were not destroyed by breaking the wafer | ||
* Find cover slips and clean. They all fit on 18x24mm cs found in drawer by plasma machine | * Find cover slips and clean. They all fit on 18x24mm cs found in drawer by plasma machine | ||
* Cut loose and peel off master | * Cut loose and peel off master | ||
| − | * punch holes for 1/16" tubes | + | * punch holes for 1/16" tubes (which punch? test!) |
* clean with tape | * clean with tape | ||
* plasma treat PDMS and CS | * plasma treat PDMS and CS | ||
* bond | * bond | ||
* connect tubes | * connect tubes | ||
| + | |||
| + | === Filling with water and gel === | ||
| + | In room 431. If we wait long time between bonding the circuit and filling it the PDMS will become hydrophobic. The main idea of the procedure is that the PDMS should be slightly hydrophobic, but not too much to get the gel into the side chambers, but not to pass the column. | ||
| + | |||
* fill circuits with distilled water | * fill circuits with distilled water | ||
| + | |||
| + | === Aliquoting | ||
Revision as of 15:17, 19 March 2021
Contents
Casting PDMS 10:1
- poured about 40 ml into disposable beaker on the balance: 32.2g
- poured curing agent by hand until weight was 35.4 g
- mixed. lots of bubbles in mixture
- put beaker in vacuum chamber
- cycled vacuum / air several times to make and break bubbles
- continued until almost all bubbles gone
- poured carefully over mask and put into oven
Preparing for the next steps
Making the mufluid circuits
In room 118
- 4 medium and 2 big circuits made were not destroyed by breaking the wafer
- Find cover slips and clean. They all fit on 18x24mm cs found in drawer by plasma machine
- Cut loose and peel off master
- punch holes for 1/16" tubes (which punch? test!)
- clean with tape
- plasma treat PDMS and CS
- bond
- connect tubes
Filling with water and gel
In room 431. If we wait long time between bonding the circuit and filling it the PDMS will become hydrophobic. The main idea of the procedure is that the PDMS should be slightly hydrophobic, but not too much to get the gel into the side chambers, but not to pass the column.
- fill circuits with distilled water
=== Aliquoting
