Difference between revisions of "20210503 photolitho"

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** prebake on programmable hot plate
 
** prebake on programmable hot plate
 
**  Masking with UV-Kub 2. UV at 11% intensity for 30 sec.
 
**  Masking with UV-Kub 2. UV at 11% intensity for 30 sec.
** Hot plate too hot, 65C postbake happened at 72-66C
+
** 10 minutes rest
** The hot plate seems to take longer than the timer on my telephone. This needs to be checked!
+
** post bake on VWR plate
** development with PGMEA for 2:45 was too long time! Misjudged the residue and continued another 30s, then it was completely destroyed.
+
* 2nd wafer  
* 2nd wafer Dag's pattern
 
 
** 3100 RPM ~ 25 um
 
** 3100 RPM ~ 25 um
 
** prebake on VWR hot plate, no nice control of ramp in temp
 
** prebake on VWR hot plate, no nice control of ramp in temp
 
**  Masking with UV-Kub 2. UV at 11% intensity for 30 sec.
 
**  Masking with UV-Kub 2. UV at 11% intensity for 30 sec.
** Postbake on VWR hotplate
+
** Postbake on programmable hotplate
** Developed 3min in PGMEA gave perfect sylinders and gaps between them. quick dip to remove a little residue and done.
+
** Developed 2:30 min in PGMEA

Revision as of 13:32, 3 May 2021

  • cleaned wafers with plasma only
  • 1st wafer
    • 3100 RPM ~ 25 um
    • prebake on programmable hot plate
    • Masking with UV-Kub 2. UV at 11% intensity for 30 sec.
    • 10 minutes rest
    • post bake on VWR plate
  • 2nd wafer
    • 3100 RPM ~ 25 um
    • prebake on VWR hot plate, no nice control of ramp in temp
    • Masking with UV-Kub 2. UV at 11% intensity for 30 sec.
    • Postbake on programmable hotplate
    • Developed 2:30 min in PGMEA