Difference between revisions of "20210503 photolitho"

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Line 6: Line 6:
 
** 10 minutes rest
 
** 10 minutes rest
 
** post bake on VWR plate
 
** post bake on VWR plate
 +
** Developed 2:30 min in PGMEA
 
* 2nd wafer  
 
* 2nd wafer  
 
** 3100 RPM ~ 25 um
 
** 3100 RPM ~ 25 um
 
** prebake on VWR hot plate, no nice control of ramp in temp
 
** prebake on VWR hot plate, no nice control of ramp in temp
 
**  Masking with UV-Kub 2. UV at 11% intensity for 30 sec.
 
**  Masking with UV-Kub 2. UV at 11% intensity for 30 sec.
 +
** 10 minutes rest
 
** Postbake on programmable hotplate
 
** Postbake on programmable hotplate
 
** Developed 2:30 min in PGMEA
 
** Developed 2:30 min in PGMEA

Revision as of 13:39, 3 May 2021

  • cleaned wafers with plasma only
  • 1st wafer
    • 3100 RPM ~ 25 um
    • prebake on programmable hot plate
    • Masking with UV-Kub 2. UV at 11% intensity for 30 sec.
    • 10 minutes rest
    • post bake on VWR plate
    • Developed 2:30 min in PGMEA
  • 2nd wafer
    • 3100 RPM ~ 25 um
    • prebake on VWR hot plate, no nice control of ramp in temp
    • Masking with UV-Kub 2. UV at 11% intensity for 30 sec.
    • 10 minutes rest
    • Postbake on programmable hotplate
    • Developed 2:30 min in PGMEA