Photolitho20240619 - MP

GM1060, 5um, 4120 rpm-40sec

wafer 1: plasma treatment >8 mins

wafer 2: 135 C 20 mins

(Spin coater setting was changed, there was no program 1- slow speed 400 rpm for 20 sec)

65-5, 95-30

UV-kub-2: 25%, 4 cycles of 4sec

65-5, 95-20

Fresh PGMEA, shake, 1 min

Submerge in IPA, rinse

Result: small features are well observed, even though SU8 surface is with many uneven bubbles.

Hard bake only 1 hr at 135, since there is no cracks.

Chemical safety precaution: keep all PGMEA-contacted waste inside hood, The hood sash should be raised higher than the thick black line with arrow.

Most frequent chance of spill: 1-during washing of PGMEA, left hand (holding the wafer) will be in contact.

2-when pouring the waste to bottles, PGMEA is spilled outside of the bottle.

Maybe need a bigger funnel? Or a glass container with a spout?