20210430 photolitho

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Revision as of 13:32, 3 May 2021 by Dagkd@uio.no (talk | contribs)

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  • Started LAF-bench
  • N2 valve had been left open, almost no pressure left!
  • cleaned wafers with plasma only
  • 1st wafer
    • 3700 RPM ~ 20 um
    • prebake on VWR plate
    • Masking with UV-Kub 2. UV at 11% intensity for 30 sec.
    • postbake on VWR plate
  • 2nd wafer
    • 3100 RPM ~ 25 um
    • prebake on programmable hot plate
    • Masking with UV-Kub 2. UV at 11% intensity for 30 sec.
    • Hot plate too hot, 65C postbake happened at 72-66C
    • The hot plate seems to take longer than the timer on my telephone. This needs to be checked!
    • development with PGMEA for 2:45 was too long time! Misjudged the residue and continued another 30s, then it was completely destroyed.