Difference between revisions of "Photolithography"

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SU8 process
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== Photolithography explained ==
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[[wikipedia:Photolithography|Photolithography]]
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== SU8 process (square features) ==
  
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[https://wiki.uio.no/mn/pgp/index.php/Lithography/SU8_process 1. Process]
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=== Procedure updated Nov 2023 ===
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# [[A Simplified Version]]
 
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# [[Mathias Busek's protocol 2020]]
 
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[https://wiki.uio.no/mn/pgp/index.php/Lithography/SU8_datasheet 2. Datasheet]
 
  
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[https://wiki.uio.no/mn/pgp/index.php/Lithography/SU8_references 3. References]
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==== Handling of chemicals ====
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==== Preparations the day before photolithography ====
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* Open a new lab note [[Photolithography lab notebooks|here]]
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** Note down your desired process
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** As you go on the day, note all observations and final result
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* Decide how thick layer of SU8 you need
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* Choose right SU8 and protocol
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** GM1060 for layers between 5-25µm. [https://wiki.uio.no/mn/fysikk/laglivlab/images/7/72/SU8_GM1060.pdf Full datasheet]
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** GM1070 for layers between 15-200µm.  [https://wiki.uio.no/mn/fysikk/laglivlab/images/5/54/SU8_GM1070.pdf Full datasheet]
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* Find and note the following parameters ([[SU8 parameters|See page with tables and notes on parameters]]):
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** Speed of spin-coater in rpm
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** Pre- and post-bake times at 65 and 95 C, t_{65}, t_{95}
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** Exposure dose (divide the number from the table by factor 2 to 4, follow Mathias' measurement, use 20% power and multiply the time by 5)
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** PGMEA development time
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* Take SU8 out of fridge and place in cupboard in 129
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* Program
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** [[Spin coater programming|Spin coater]]
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** [[Hot plate programming|Hotplate]]
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==== Materials and tools ====
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* SU8
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* Wafer (3" or 4")
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* Isopropanol
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* Wafer tweezers (in LAF bench and fume hood)
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* Fine tipped tweezer
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* Clean glass plate for placing wafers on
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* N2 guns in 128 and 129
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* Beaker and wafer holder for development
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* Lint free paper
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==== Procedure ====
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* Turn on N2
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* Turn on and open LAF bench
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* Turn off N2
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* Turn off and close LAF bench
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=== Procedure notes before Nov 2023 ===
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* [[Full process|Full description of process]]
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* [[Simplified process|A Simplified Version]]
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*  [[Mathias' process|Mathias Busek's protocol 2020]]
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== Programming various equipment ==
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=== [[UV KUB|UV KUB programming]] === 
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=== [[Spin coater programming]] ===
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=== [[Hot plate programming]] ===
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=== Important notes 05.03.2021 ===
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* UV doses in the tables are too large. Look at comments in Matias Busek's protocol
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* The programmable hotplate is not reliable
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** Two times in a row the same procedure for 25 um thick substrate with VWR and programmable hot plates gave good results for VWR hotplate but overdevelopment for programmable hotplate.
 +
** I have observed that the programmable hotplate seems to spend too long time at each step.
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== XT process (rounded channels) ==

Latest revision as of 15:41, 21 December 2023

Photolithography explained

Photolithography

SU8 process (square features)

Procedure updated Nov 2023

Handling of chemicals

Preparations the day before photolithography

  • Open a new lab note here
    • Note down your desired process
    • As you go on the day, note all observations and final result
  • Decide how thick layer of SU8 you need
  • Choose right SU8 and protocol
  • Find and note the following parameters (See page with tables and notes on parameters):
    • Speed of spin-coater in rpm
    • Pre- and post-bake times at 65 and 95 C, t_{65}, t_{95}
    • Exposure dose (divide the number from the table by factor 2 to 4, follow Mathias' measurement, use 20% power and multiply the time by 5)
    • PGMEA development time
  • Take SU8 out of fridge and place in cupboard in 129
  • Program

Materials and tools

  • SU8
  • Wafer (3" or 4")
  • Isopropanol
  • Wafer tweezers (in LAF bench and fume hood)
  • Fine tipped tweezer
  • Clean glass plate for placing wafers on
  • N2 guns in 128 and 129
  • Beaker and wafer holder for development
  • Lint free paper

Procedure

  • Turn on N2
  • Turn on and open LAF bench


  • Turn off N2
  • Turn off and close LAF bench

Procedure notes before Nov 2023

Programming various equipment

UV KUB programming

Spin coater programming

Hot plate programming

Important notes 05.03.2021

  • UV doses in the tables are too large. Look at comments in Matias Busek's protocol
  • The programmable hotplate is not reliable
    • Two times in a row the same procedure for 25 um thick substrate with VWR and programmable hot plates gave good results for VWR hotplate but overdevelopment for programmable hotplate.
    • I have observed that the programmable hotplate seems to spend too long time at each step.

XT process (rounded channels)

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