Difference between revisions of "Photolithography"
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− | SU8 process | + | == Photolithography explained == |
+ | [[wikipedia:Photolithography|Photolithography]] | ||
+ | == SU8 process (square features) == | ||
− | + | === Procedure updated Nov 2023 === | |
− | |||
− | |||
− | |||
− | [https://wiki.uio.no/mn/ | + | ==== Handling of chemicals ==== |
+ | |||
+ | ==== Preparations the day before photolithography ==== | ||
+ | * Open a new lab note [[Photolithography lab notebooks|here]] | ||
+ | ** Note down your desired process | ||
+ | ** As you go on the day, note all observations and final result | ||
+ | * Decide how thick layer of SU8 you need | ||
+ | * Choose right SU8 and protocol | ||
+ | ** GM1060 for layers between 5-25µm. [https://wiki.uio.no/mn/fysikk/laglivlab/images/7/72/SU8_GM1060.pdf Full datasheet] | ||
+ | ** GM1070 for layers between 15-200µm. [https://wiki.uio.no/mn/fysikk/laglivlab/images/5/54/SU8_GM1070.pdf Full datasheet] | ||
+ | * Find and note the following parameters ([[SU8 parameters|See page with tables and notes on parameters]]): | ||
+ | ** Speed of spin-coater in rpm | ||
+ | ** Pre- and post-bake times at 65 and 95 C, t_{65}, t_{95} | ||
+ | ** Exposure dose (divide the number from the table by factor 2 to 4, follow Mathias' measurement, use 20% power and multiply the time by 5) | ||
+ | ** PGMEA development time | ||
+ | * Take SU8 out of fridge and place in cupboard in 129 | ||
+ | * Program | ||
+ | ** [[Spin coater programming|Spin coater]] | ||
+ | ** [[Hot plate programming|Hotplate]] | ||
+ | |||
+ | ==== Materials and tools ==== | ||
+ | * SU8 | ||
+ | * Wafer (3" or 4") | ||
+ | * Isopropanol | ||
+ | * Wafer tweezers (in LAF bench and fume hood) | ||
+ | * Fine tipped tweezer | ||
+ | * Clean glass plate for placing wafers on | ||
+ | * N2 guns in 128 and 129 | ||
+ | * Beaker and wafer holder for development | ||
+ | * Lint free paper | ||
+ | |||
+ | ==== Procedure ==== | ||
+ | |||
+ | * Turn on N2 | ||
+ | * Turn on and open LAF bench | ||
+ | |||
+ | |||
+ | |||
+ | * Turn off N2 | ||
+ | * Turn off and close LAF bench | ||
+ | |||
+ | === Procedure notes before Nov 2023 === | ||
+ | * [[Full process|Full description of process]] | ||
+ | |||
+ | * [[Simplified process|A Simplified Version]] | ||
+ | |||
+ | * [[Mathias' process|Mathias Busek's protocol 2020]] | ||
+ | |||
+ | == Programming various equipment == | ||
+ | |||
+ | === [[UV KUB|UV KUB programming]] === | ||
+ | |||
+ | === [[Spin coater programming]] === | ||
+ | |||
+ | === [[Hot plate programming]] === | ||
+ | |||
+ | === Important notes 05.03.2021 === | ||
+ | * UV doses in the tables are too large. Look at comments in Matias Busek's protocol | ||
+ | * The programmable hotplate is not reliable | ||
+ | ** Two times in a row the same procedure for 25 um thick substrate with VWR and programmable hot plates gave good results for VWR hotplate but overdevelopment for programmable hotplate. | ||
+ | ** I have observed that the programmable hotplate seems to spend too long time at each step. | ||
+ | |||
+ | == XT process (rounded channels) == |
Latest revision as of 15:41, 21 December 2023
Contents
Photolithography explained
SU8 process (square features)
Procedure updated Nov 2023
Handling of chemicals
Preparations the day before photolithography
- Open a new lab note here
- Note down your desired process
- As you go on the day, note all observations and final result
- Decide how thick layer of SU8 you need
- Choose right SU8 and protocol
- GM1060 for layers between 5-25µm. Full datasheet
- GM1070 for layers between 15-200µm. Full datasheet
- Find and note the following parameters (See page with tables and notes on parameters):
- Speed of spin-coater in rpm
- Pre- and post-bake times at 65 and 95 C, t_{65}, t_{95}
- Exposure dose (divide the number from the table by factor 2 to 4, follow Mathias' measurement, use 20% power and multiply the time by 5)
- PGMEA development time
- Take SU8 out of fridge and place in cupboard in 129
- Program
Materials and tools
- SU8
- Wafer (3" or 4")
- Isopropanol
- Wafer tweezers (in LAF bench and fume hood)
- Fine tipped tweezer
- Clean glass plate for placing wafers on
- N2 guns in 128 and 129
- Beaker and wafer holder for development
- Lint free paper
Procedure
- Turn on N2
- Turn on and open LAF bench
- Turn off N2
- Turn off and close LAF bench
Procedure notes before Nov 2023
Programming various equipment
UV KUB programming
Spin coater programming
Hot plate programming
Important notes 05.03.2021
- UV doses in the tables are too large. Look at comments in Matias Busek's protocol
- The programmable hotplate is not reliable
- Two times in a row the same procedure for 25 um thick substrate with VWR and programmable hot plates gave good results for VWR hotplate but overdevelopment for programmable hotplate.
- I have observed that the programmable hotplate seems to spend too long time at each step.