Difference between revisions of "Photolithography"

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(Preparations the day before photolithography)
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==== Preparations the day before photolithography ====
 
==== Preparations the day before photolithography ====
* Open a new lab note here
+
* Open a new lab note [[Photolithography lab notebooks|here]]
 
** Note down your desired process
 
** Note down your desired process
 
** As you go on the day, note all observations and final result
 
** As you go on the day, note all observations and final result

Revision as of 15:26, 10 November 2023

Photolithography explained

Photolithography

SU8 process (square features)

Procedure updated Nov 2023

Handling of chemicals

Preparations the day before photolithography

  • Open a new lab note here
    • Note down your desired process
    • As you go on the day, note all observations and final result
  • Decide how thick layer of SU8 you need
  • Choose right SU8 and protocol
    • GM1060 for layers between 5-25µm. Full datasheet
    • GM1070 for layers between 25-200µm. Full datasheet
  • Find and note the following parameters:
    • Speed of spin-coater in rpm
    • Pre- and post-bake times at 65 and 95 C, t_{65}, t_{95}
    • Exposure dose
    • PGMEA development time

Procedure notes before Nov 2023

Programming various equipment

UV KUB programming

Spin coater programming

Hot plate programming

Important notes 05.03.2021

  • UV doses in the tables are too large. Look at comments in Matias Busek's protocol
  • The programmable hotplate is not reliable
    • Two times in a row the same procedure for 25 um thick substrate with VWR and programmable hot plates gave good results for VWR hotplate but overdevelopment for programmable hotplate.
    • I have observed that the programmable hotplate seems to spend too long time at each step.

XT process (rounded channels)