Photolithography
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Revision as of 15:36, 10 November 2023 by Dagkd@uio.no (talk | contribs)
Contents
Photolithography explained
SU8 process (square features)
Procedure updated Nov 2023
Handling of chemicals
Preparations the day before photolithography
- Open a new lab note here
- Note down your desired process
- As you go on the day, note all observations and final result
- Decide how thick layer of SU8 you need
- Choose right SU8 and protocol
- GM1060 for layers between 5-25µm. Full datasheet
- GM1070 for layers between 25-200µm. Full datasheet
- Find and note the following parameters:
- Speed of spin-coater in rpm
- Pre- and post-bake times at 65 and 95 C, t_{65}, t_{95}
- Exposure dose
- PGMEA development time
Procedure notes before Nov 2023
Programming various equipment
UV KUB programming
Spin coater programming
Hot plate programming
Important notes 05.03.2021
- UV doses in the tables are too large. Look at comments in Matias Busek's protocol
- The programmable hotplate is not reliable
- Two times in a row the same procedure for 25 um thick substrate with VWR and programmable hot plates gave good results for VWR hotplate but overdevelopment for programmable hotplate.
- I have observed that the programmable hotplate seems to spend too long time at each step.
